KESTER
NOW RECOMMENDING SN100C TYPE ALLOY FOR LEAD
FREE WAVE SOLDERING
At Productronica 2005 last month, Kester Solder
launched their SN100C “copy” being sold under the
name “K100”. This indicates they have now realized
that SN100C is the best option for lead free wave
soldering. There is no reliability data available
on K100, which contains less nickel than the SN100C
specified amount. The table below highlights comparisons
of SN100C to the competitor's attempted copies
and SAC305.
CHARACTERISTIC |
SN100C |
KESTER
K100 |
TIN/3Ag/.5Cu
(SAC305) |
ALPHA
X0307
TIN/0.3Ag/.7Cu/Bi |
SMOOTH,
SHINY JOINT? |
YES |
? |
NO |
NO |
REACTIVITY
TO EQUIPMENT |
LOW |
? |
HIGH |
HIGH |
EUTECTIC?
(PASTE RANGE) |
YES |
? |
NO
(4 ° C) |
NO
(10 ° C) |
CONTAINS
BISMUTH? |
NO |
? |
NO |
YES |
EASY
POT MANAGEMENT? |
YES |
? |
NO |
NO |
LOW
COST? |
YES |
YES |
NO |
YES |
LOW
DROSSING? |
YES |
? |
NO |
NO |
COPPER
DISSOLUTION? |
SLOW |
? |
VERY
FAST |
FAST |
RELIABILITY
TESTS |
YES |
??? |
YES |
YES |
RELIABILITY UPDATE FOR SN100C
This report is the fourth of a
five part series highlighting the results of recent
reliability testing comparing the Nihon Superior
SN100C nickel stabilized tin/copper alloy to tin/lead
and SAC alloys. The full report is available by
contacting Jim Wertin at jwertin@fctassembly.com.
One of the primary concerns in the industry today
is whether converting to a lead free process from
tin/lead will have an impact on the reliability
of the assembly. Much testing has been performed
in the last 10 years on lead free joints in anticipation
of the potential switch by the industry but there
are still concerns about the applicability of the
results. Most of the testing has been to procedures
developed over time for tin/lead alloys and the
issue is whether there will be the same correlation
between test results and actual product life cycle
of lead free products in the field. As reliability
is a complex issue, and not just thermal cycling,
a number of tests were performed to attempt to
simulate the environment in use.
The testing included vibration, thermal shock,
HALT testing, salt fog, temperature/humidity, thermal
cycling at multiple ranges performed for the JG-PP
Lead Free Solder Project, and hand solder repair
with mixed alloys with cross sectioning and thermal
cycling.
Thermal cycle results will be discussed in this
report.
Two thermal cycle tests were performed in the
JG-PP study (www.jgpp.com).
-20°C/+80°C Thermal Cycling
The -20°C/+80°C thermal cycling was performed
by Tom Woodrow at Boeing. After 6300 cycles, there has been no
failure of the SN100C soldered PDIP's. The test will continue
until 10,000 cycles are completed, which is estimated to be by
April 2006.
The -55°C/+125°C thermal cycling
The -55°C/+125°C thermal cycling was
performed by Dave Hillman at Rockwell Collins.
After 4656 cycles, The SN100C manufactured boards
are performing as well as both SN63 and SAC soldered
boards as highlighted in the tables below:
BOARD/ALLOY |
NUMBER
OF FAILURES |
SN63
CONTROL MANUFACTURED |
2 |
SAC
MANUFACTURED |
5 |
SN100C
MANUFACTURED |
3 |
SN63
CONTROL REPAIRED |
3 |
SAC
REPAIRED |
3 |
SN100C
REPAIRED |
8 |
THERMAL CYCLING RESULTS -55°C/+125 °C

Be sure to visit us at Apex 2006 for SN100C
solder pot conversion specials . We are
located in Booth 1892. Nihon Superior is located
in Booth 1487.
SN100C has been patented by Nihon Superior and
is offered worldwide through licensed manufacturers
including FCT Solder for North America. We offer
SN100C for wave solder and lead tinning, reflow
solder paste applications, and SN100CL for lead
free hot air solder leveling (HASL) of P.C. Boards.
We will be including in future newsletters, many
of the advantages our current customers have discovered
in switching to SN100C as their lead free alloy
of choice and we welcome your comments and questions.
We look forward to working with you to make your
transition to lead free as successful as possible. |