|
Lead Free Soldering Seminar Agenda: |
8:30 AM |
Registration & Continental
Breakfast
|
9:00 AM |
Introduction to Lead Free Soldering
- Industry status on Lead Free
- Properties critical to good soldering?
- Environmental impact of new alloy?
- Proven track record of volume production use?
|
10:00 AM |
Alloy Systems
- Alloy system review/comparison
- Standard Tin/Lead versus Lead-Free physical property comparison
|
11:00 AM |
Wave Solder
|
| 11:30 AM |
Lunch (provided) |
12:30 PM |
Reflow
- Reflow Machine parameter and profiling recommendations
- Solder Paste stability
- Alloy system review/comparison
- Issues related to process switchover from lead to no-lead
|
| 1:15 PM |
Reliability |
2:00 PM |
Hand Soldering / Component Issues
- Process changes for hand soldering
- Component issues
|
2:30 PM |
Board Finishes
- Lead Free Options
- Lead Free HASL
- Immersion Tin
- Comparison of Finishes
|
